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Cordially Invited | ASMADE Zhuoxing Semiconductor Meets You at CIOE 2026 — The 27th China International Optoelectronic Exposition
———— 2026-08-24Asmade (Shenzhen) Technology LimitedCordially Invited | ASMADE Zhuoxing Semiconductor Meets You at CIOE 2026 — The 27th China International Optoelectronic ExpositionFrom September 9–11, 2026, ASMADE Zhuoxing Semiconductor will make a ...
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Mass Production Breakthrough of Automotive Backlight Mini/Micro LED: Process Bottlenecks of MIP Route & Flip Chip Bonding Solutions
———— 2026-07-31Asmade (Shenzhen) Technology LimitedAs smart cockpits evolve toward larger sizes and higher image quality, the global automotive Mini/Micro LED backlight market is set to exceed USD 1.2 billion in 2026 with a CAGR of over 85%, becoming one of the fastest-growing segments in the advanced display ...
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Flip Chip Bonding: Core Process to Break Through Mass Production Yield Bottlenecks of Micro LED MIP
———— 2026-07-24Asmade (Shenzhen) Technology LimitedThe article elaborates on the core mechanism of flip chip bonding that restructures the force-bearing surface to the high-hardness sapphire substrate, realizing zero contact force on the electrode surface throughout the whole process, and details its four core...
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Zhuoxing SpinBus360 Wireless EtherCAT Transmission |Break Free from Slip Ring Restrictions to Achieve 360° Continuous Rotation Communication
———— 2026-07-01Asmade (Shenzhen) Technology LimitedBreak free from the limitations and failures of traditional slip rings. Discover Zhuoxing SpinBus360, a native EtherCAT-compatible, contactless transmission system that delivers high-bandwidth data and stable power wirelessly. Achieve precise, reliable, and ma...
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AS3606 Flip Chip Bonder | Zero Die Puncture Damage, Resolving Mass Production Bottlenecks of Micro LED MIP
———— 2026-06-25Asmade (Shenzhen) Technology LimitedWe have conducted an in-depth analysis of the core pain points in the mass production of Micro LED MIP (Micro LED in Package), specifically the issue of \"chip electrode damage\" caused by traditional die bonding processes and the resulting high yield loss. To...
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Real-Time Control with Standard C! Microsecond Hard Real-Time, Rapid Solution Deployment
———— 2026-05-29Asmade (Shenzhen) Technology LimitedThis article introduces the AsMotion motion control solution, which leverages a hard real-time architecture based on standard C language and X86 hardware to address the core challenges in high-end precision equipment development—such as low stability, high de...
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AI Computing Power Surges: Domestic Micron-Level Die Bonder Solves High-Speed Optical Module Packaging Bottlenecks
———— 2026-05-20Asmade (Shenzhen) Technology LimitedZhuoxing Semiconductor, a national‑level “Specialized, Sophisticated, Unique, New” Little Giant enterprise, introduces the AS8136 high‑precision die bonder to meet the packaging‑upgrade needs driven by AI computing power. Leveraging 20 years of expertise...
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For Precision Automation: High-Performance Lightweight Voice Coil Control Solution
———— 2026-04-24Asmade (Shenzhen) Technology LimitedZhuoxing Semiconductor introduces a cutting-edge high-performance lightweight voice coil control solution, tailored for precision automation equipment in semiconductor packaging, precision alignment, high-speed inspection, and micro-assembly applications. This...
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You Are Cordially Invited | ASMADE Joins You at SEMICON China 2026 & electronica China
———— 2026-03-18Asmade (Shenzhen) Technology LimitedASMADE, a leading provider of high-precision semiconductor equipment, is excited to announce its participation in SEMICON China 2026 and electronica China from March 25 to 27, 2026, at the Shanghai New International Expo Centre. The company will showcase its l...
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Technological Breakthrough! Chip-Level Printer Adds Three New Features
———— 2026-01-31Asmade (Shenzhen) Technology LimitedZhuoxing Semiconductor has achieved a technological breakthrough with its AS7301 chip-level printer, introducing three new features: dual-mode flexible feeding, intelligent automatic solder paste addition, and an AOI component. These innovations enhance produc...
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Multi-Process vs. Precision vs. Speed: How to Simultaneously Balance the Equipment
———— 2025-09-28Asmade (Shenzhen) Technology LimitedIn the semiconductor packaging industry, the challenge of balancing multi-process requirements, precision, and speed is critical. Traditional manufacturing faces limitations due to dedicated machines for specific processes, leading to high capital costs and in...
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Automatic Ejector Needle Switching Technology | Solving Multi-Material Mixed Mounting Challenges
———— 2025-12-04Asmade (Shenzhen) Technology LimitedIn semiconductor packaging processes, the challenge of multi-material mixed mounting arises due to the need to accommodate chips and components of varying sizes and feeding methods. Traditional equipment struggles with frequent ejector needle changes and shutd...
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Automotive Mini LED Backlight: Efficient Solution for "Multi-Category, Small-Batch" Production + Automotive-Grade Quality Assurance
———— 2025-11-22Asmade (Shenzhen) Technology LimitedIn the field of automotive Mini LED backlight manufacturing, two core challenges persist: insufficient equipment compatibility and line changeover efficiency under the \"multi-category, small-batch\" production model, as well as difficulties in achieving tradi...
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AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency
———— 2025-08-04Asmade (Shenzhen) Technology LimitedlEquipping dual vibrationfeeding, andsupporting0606–2121 LEDbeads, Package and otherbulkcomponentmountingat any pitch.lFeaturing highquickchangeoverefficiencyand self-programming mixed-mountcapabilit...
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On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging
———— 2025-07-29Asmade (Shenzhen) Technology LimitedIn theclip bonding packagingprocess of power devices, dispensing on the chip is crucial for ensuring tight bonding of the clip, which in turn guarantees a stable electrical connection between the clip...
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Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
———— 2025-05-22Asmade (Shenzhen) Technology LimitedThe world's first semiconductor chip-level printer with narrow-edge printing enables high precision 3D step printing. It can print on chips under high precision pressure control.It is applied in p...
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Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
———— 2025-04-24Asmade (Shenzhen) Technology LimitedThe Epoxy Die Bonder is a semiconductor machine that features both the spot epoxy process and die bonding process. It can conduct spot epoxy processes and stamping processes using epoxy and other adhe...
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ASMADE cordially invites you to SEMICON CHINA 2025.
———— 2025-03-24Asmade (Shenzhen) Technology LimitedASMADE cordially invites you to SEMICON CHINA 2025.From March 26th to 28th, 2025, ASMADE will showcase new semiconductor die bonding solutions in the fields of semiconductor packaging, optical module ...
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Competitiveness Analysis of MiniLED Backlight Packaging Enterprises in Chinese Mainland
———— 2023-05-12Asmade (Shenzhen) Technology LimitedIn the past decade, the LED industry has focused on lighting, while in the next decade, the LED industry will focus on displays. Specifically, it should be new displays, mainly including Mini LED and Micro LED. The Micro LED market still has a long way to go b...
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Three Key Words to Look at the Current Situation of Mini LED Packaging End
———— 2023-05-12Asmade (Shenzhen) Technology LimitedAt the packaging end, due to the production rhythm being constrained by upstream production capacity and directly affecting the output of downstream applications, the production capacity and technological progress at the packaging end are particularly concerne...
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New Information
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Cordially Invited | ASMADE Zhuoxing Semiconductor Meets You at CIOE 2026 — The 27th China International Optoelectronic Exposition
Cordially Invited | ASMADE Zhuoxing Semiconductor Meets You ...
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Mass Production Breakthrough of Automotive Backlight Mini/Micro LED: Process Bottlenecks of MIP Route & Flip Chip Bonding Solutions
As smart cockpits evolve toward larger sizes and higher imag...
-
Flip Chip Bonding: Core Process to Break Through Mass Production Yield Bottlenecks of Micro LED MIP
The article elaborates on the core mechanism of flip chip bo...
-
Zhuoxing SpinBus360 Wireless EtherCAT Transmission |Break Free from Slip Ring Restrictions to Achieve 360° Continuous Rotation Communication
Break free from the limitations and failures of traditional ...
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0755-29691921