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Technological Breakthrough! Chip-Level Printer Adds Three New Features
———— 2026-01-31Asmade (Shenzhen) Technology LimitedZhuoxing Semiconductor has achieved a technological breakthrough with its AS7301 chip-level printer, introducing three new features: dual-mode flexible feeding, intelligent automatic solder paste addition, and an AOI component. These innovations enhance produc...
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Multi-Process vs. Precision vs. Speed: How to Simultaneously Balance the Equipment
———— 2025-09-28Asmade (Shenzhen) Technology LimitedIn the semiconductor packaging industry, the challenge of balancing multi-process requirements, precision, and speed is critical. Traditional manufacturing faces limitations due to dedicated machines for specific processes, leading to high capital costs and in...
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Automatic Ejector Needle Switching Technology | Solving Multi-Material Mixed Mounting Challenges
———— 2025-12-04Asmade (Shenzhen) Technology LimitedIn semiconductor packaging processes, the challenge of multi-material mixed mounting arises due to the need to accommodate chips and components of varying sizes and feeding methods. Traditional equipment struggles with frequent ejector needle changes and shutd...
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Automotive Mini LED Backlight: Efficient Solution for "Multi-Category, Small-Batch" Production + Automotive-Grade Quality Assurance
———— 2025-11-22Asmade (Shenzhen) Technology LimitedIn the field of automotive Mini LED backlight manufacturing, two core challenges persist: insufficient equipment compatibility and line changeover efficiency under the \"multi-category, small-batch\" production model, as well as difficulties in achieving tradi...
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AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency
———— 2025-08-04Asmade (Shenzhen) Technology LimitedlEquipping dual vibrationfeeding, andsupporting0606–2121 LEDbeads, Package and otherbulkcomponentmountingat any pitch.lFeaturing highquickchangeoverefficiencyand self-programming mixed-mountcapabilit...
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On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging
———— 2025-07-29Asmade (Shenzhen) Technology LimitedIn theclip bonding packagingprocess of power devices, dispensing on the chip is crucial for ensuring tight bonding of the clip, which in turn guarantees a stable electrical connection between the clip...
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Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
———— 2025-05-22Asmade (Shenzhen) Technology LimitedThe world's first semiconductor chip-level printer with narrow-edge printing enables high precision 3D step printing. It can print on chips under high precision pressure control.It is applied in p...
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Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
———— 2025-04-24Asmade (Shenzhen) Technology LimitedThe Epoxy Die Bonder is a semiconductor machine that features both the spot epoxy process and die bonding process. It can conduct spot epoxy processes and stamping processes using epoxy and other adhe...
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There are many difficulties in Mini-LED packaging, what are the best solutions to solve the printing process problems?
———— 2023-05-10Asmade (Shenzhen) Technology LimitedIn recent years, with the rapid development of the panel industry and the crazy expansion of domestic manufacturers, the relationship between supply and demand of products has been basically eased, and manufacturers began to focus on the improvement of product...
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Packaging technology is more important than chip technology in Mini LED technology
———— 2023-05-10Asmade (Shenzhen) Technology LimitedMaking Mini LED display panel products involves various comprehensive technologies such as LED chips, packaging, PCB board design and manufacturing, materials, equipment, testing, repair, production process
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Mini LED packaging equipment leading semiconductor business with unlimited potential for expansion
———— 2023-05-10Asmade (Shenzhen) Technology LimitedMini LED direct display ushers in its explosive first year. In 2019, the size of China\'s Mini LED market was around 1.6 billion yuan, and it is expected to reach 3.78 billion yuan in 20 years, a year-on-year increase of 140%;
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Has the times changed? Why are old crystal solidification machines at a loss when facing Mini LEDs?
———— 2023-05-10Asmade (Shenzhen) Technology LimitedThe traditional LED display market is booming, but as human demand for visual experience continues to increase and technology continues to update and develop
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When will China enter the era of "incremental" competition in semiconductor mergers and acquisitions?
———— 2023-05-10Asmade (Shenzhen) Technology LimitedAfter entering 2020, the global economic situation has been worrisome due to the impact of the epidemic. However, the semiconductor industry has become a major highlight in the sluggish economic environment due to its position at the top of the industrial chai...
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New Information
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You Are Cordially Invited | ASMADE Joins You at SEMICON China 2026 & electronica China
ASMADE, a leading provider of high-precision semiconductor e...
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Technological Breakthrough! Chip-Level Printer Adds Three New Features
Zhuoxing Semiconductor has achieved a technological breakthr...
-
Multi-Process vs. Precision vs. Speed: How to Simultaneously Balance the Equipment
In the semiconductor packaging industry, the challenge of ba...
-
Automatic Ejector Needle Switching Technology | Solving Multi-Material Mixed Mounting Challenges
In semiconductor packaging processes, the challenge of multi...
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0755-29691921