Industry Information-Asmade (Shenzhen) Technology Limited

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

lEquipping dual vibrationfeeding, andsupporting0606–2121 LEDbeads, Package and otherbulkcomponentmountingat any pitch.lFeaturing highquickchangeoverefficiencyand self-programming mixed-mountcapabilit...
On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

In theclip bonding packagingprocess of power devices, dispensing on the chip is crucial for ensuring tight bonding of the clip, which in turn guarantees a stable electrical connection between the clip...
Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

The world's first semiconductor chip-level printer with narrow-edge printing enables high precision 3D step printing. It can print on chips under high precision pressure control.It is applied in p...

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency
———— 2025-08-04Asmade (Shenzhen) Technology Limited
lEquipping dual vibrationfeeding, andsupporting0606–2121 LEDbeads, Package and otherbulkcomponentmountingat any pitch.lFeaturing highquickchangeoverefficiencyand self-programming mixed-mountcapabilit...
MORE +
On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging
———— 2025-07-29Asmade (Shenzhen) Technology Limited
In theclip bonding packagingprocess of power devices, dispensing on the chip is crucial for ensuring tight bonding of the clip, which in turn guarantees a stable electrical connection between the clip...
MORE +
Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
———— 2025-05-22Asmade (Shenzhen) Technology Limited
The world's first semiconductor chip-level printer with narrow-edge printing enables high precision 3D step printing. It can print on chips under high precision pressure control.It is applied in p...
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Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
———— 2025-04-24Asmade (Shenzhen) Technology Limited
The Epoxy Die Bonder is a semiconductor machine that features both the spot epoxy process and die bonding process. It can conduct spot epoxy processes and stamping processes using epoxy and other adhe...
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There are many difficulties in Mini-LED packaging, what are the best solutions to solve the printing process problems?
———— 2023-05-10Asmade (Shenzhen) Technology Limited
In recent years, with the rapid development of the panel industry and the crazy expansion of domestic manufacturers, the relationship between supply and demand of products has been basically eased, and manufacturers began to focus on the improvement of product...
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Packaging technology is more important than chip technology in Mini LED technology
———— 2023-05-10Asmade (Shenzhen) Technology Limited
Making Mini LED display panel products involves various comprehensive technologies such as LED chips, packaging, PCB board design and manufacturing, materials, equipment, testing, repair, production process
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Mini LED packaging equipment leading semiconductor business with unlimited potential for expansion
———— 2023-05-10Asmade (Shenzhen) Technology Limited
Mini LED direct display ushers in its explosive first year. In 2019, the size of China\'s Mini LED market was around 1.6 billion yuan, and it is expected to reach 3.78 billion yuan in 20 years, a year-on-year increase of 140%;
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Has the times changed? Why are old crystal solidification machines at a loss when facing Mini LEDs?
———— 2023-05-10Asmade (Shenzhen) Technology Limited
The traditional LED display market is booming, but as human demand for visual experience continues to increase and technology continues to update and develop
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When will China enter the era of "incremental" competition in semiconductor mergers and acquisitions?
———— 2023-05-10Asmade (Shenzhen) Technology Limited
After entering 2020, the global economic situation has been worrisome due to the impact of the epidemic. However, the semiconductor industry has become a major highlight in the sluggish economic environment due to its position at the top of the industrial chai...
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New Information

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

lEquipping dual vibrationfeeding, andsupporting0606–2121 LE...
On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

In theclip bonding packagingprocess of power devices, dispen...
Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

The world's first semiconductor chip-level printer with ...
Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.

The Epoxy Die Bonder is a semiconductor machine that feature...

0755-29691921

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Fax：0755-29691921

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Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province

Hotline:0755-29691921

News

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.

There are many difficulties in Mini-LED packaging, what are the best solutions to solve the printing process problems?

Packaging technology is more important than chip technology in Mini LED technology

Mini LED packaging equipment leading semiconductor business with unlimited potential for expansion

Has the times changed? Why are old crystal solidification machines at a loss when facing Mini LEDs?

When will China enter the era of "incremental" competition in semiconductor mergers and acquisitions?

New Information

AS3201 Bulk Component Mounter: Supporting LED Beads and Bulk Component Mounting at Any Pitch, and Improving Quick Changeover Efficiency

On-Chip Printing | Effectively Solving Dispensing and Printing Issues in Power Device Packaging

Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology

Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.

0755-29691921

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