ASMADE-Semiconductor Package-CLIP Bonder-Die Bonder-UHD Display Solutions

Hotline:0755-29691921
CN

Asmade’s Machines

Solution

Mini LED Intelligent Manufacturing LineAutomatic Clip Bonding Solution

ABOUT US

ASMADE | Provide Die Bond Solution for Semiconductor Packaging

更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩更多精彩 更多精彩更多精彩更多精彩更多精彩

LOCATION: Provide comprehensive solution for semiconductor packaging.

SLOGAN: Semiconductor Package Solution, ASMADE Leading New Technologies.

MISSION: Providing the power of technology for a better future.

VISION: Be the worldwide leading semiconductor manufacturing equipment & services provider.

SENSE OF WORTH: Integrity Sincerity Creativity Superiority.

TALENT CONCEPT: Striving to be the best,Continuous improvement,Respect for individuality ,Co

operation and Win-Win.


  • 2015YEstablished
  • 200+Employee
  • 2000Annual production
  • 9000production base

News Center

Enterprise NewsIndustry InformationActivity Exhibition