ASMADE-Semiconductor Package-CLIP Bonder-Die Bonder-UHD Display Solutions

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Machines

Pixel Die Bonder AS3601

Triple arm alternating crystal solidification improves crystal solidification efficiency, and crystal vision completes the positioning of RGB three wafers in one shot, reducing the number of crystal solidification platform movements.

Hotline:

0755-29691921

Introduction

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Features:

Pixel Die Bonder AS3601 Features:

1.  Once Locating, 3 Colour Die Bond.

2.  RGB 3-colour independent parameter settings to ensure the yield of die bond.

3.  Supports mixed operation of single-machine multi-ring and multi-machine multi-ring combinations.

4.  Adopting marble machine workplace for higher stability.

5.  Adopt linear motor module for higher durability.

6.  Vacuum inspection to bonding omissions and anti-clogging nozzle design.

7.  Vacuum die bonding platform and surface flatness correction design.

8.  Parallel electronic connection, substrate automatically back-in back-out

9.  Die ring automatic calibration on die picking platform.

10.  Automatic die ring switch, flying shot, and ring angle correction.

11.  Self-developed software operation and control platform for intelligent equipment operation.

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Hotline:0755-29691921

Phone:0755-29691921

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