From March 25 to 27, 2026, ASMADE will showcase its latest semiconductor die bonding solutions, focusing on optical module packaging, advanced semiconductor packaging, power devices, and Mini/Micro LED at SEMICON China 2026 and electronica China.

Date: March 25–27, 2026
Venue: Shanghai New International Expo Centre

Booth Numbers
SEMICON China 2026 → Hall T4, Booth 212
electronica China → Hall E5, Booth 5272
We look forward to meeting you at the exhibition to exchange ideas and explore collaboration opportunities.

Products on Display
AS8136 High Precision Multi-Function Die Bonder

Semiconductor Packaging | 3rd Generation Turret Mounting | Accuracy ±3μm
Applications: Optical Modules, LiDAR, Sensors, SIP, Chiplet

AS8123 High Precision Epoxy Die Bonder

Semiconductor Packaging | 4-Point Dispensing Mechanism | Compatible with Multi-Size Wafers
Applications: Sensors, SIP, Chiplet, IC, Power Devices with Epoxy Process, MOSFET

AS3601 Pixel Die Bonder

Ultra HD Display | RGB Mixed Mounting Solution | Parallel Connection
Applications: Mini LED COB

Booth Information

We welcome experts and partners to visit us on-site to exchange insights on cutting-edge technologies and explore cooperation opportunities. We look forward to meeting you at the exhibition to strengthen connections, expand business prospects, and build the future of the industry together.

About Us
Founded by a world-leading team of motion control experts and bringing together top-tier packaging technology specialists, ASMADE is a national high-tech enterprise and a specialized and sophisticated "Little Giant" company with over 20 years of technical expertise and market experience. The company focuses on the R&D, manufacturing, and sales of high-precision semiconductor equipment.

Our core products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control systems, and semiconductor packaging process management solutions.

Committed to providing customers with one-stop semiconductor packaging process solutions, all our products are developed with fully independent intellectual property rights, and many of our equipment models are industry-first innovations.