Automatic Ejector Needle Switching Technology Solves Multi-Material Mixed Mounting Challenges

In semiconductor packaging processes, multi-material integration equipment often faces the challenge of having to be compatible with chips and components of different sizes and feeding methods.

When switching materials, traditional equipment typically requires ejector needle changes, with frequent shutdowns for debugging and needle replacement, seriously impacting production efficiency and continuity.

01 Automatic Ejector Needle Switching Technology

Solving Efficiency Challenges in Multi-Material Mixed Mounting, Enabling Flexible Production

How can equipment efficiently adapt to multi-sized chips and achieve non-stop production?

The key lies in Automatic Ejector Needle Switching Technology

Chips in the market vary in size and thickness. If the ejector needle remains fixed, small chips may crack, while large chips cannot be properly ejected. The role of the ejector needle is to push upward precisely from below the blue film, separating the chip edge from the film, allowing the nozzle to pick it up smoothly.

Additionally, different product categories require adaptation to various chip sizes. When adapting to multi-material mixed integration mounting, ejector needles need to be replaced and equipment debugging performed, resulting in significant time waste.

Based on the above reasons, equipment must possess automatic ejector needle switching capability. Without the ability to flexibly change ejector needles, each switch between different materials requires shutdown adjustment, severely impacting production efficiency.

Automatic Ejector Needle Switching Technology uses a turret to quickly replace matching ejector needle modules, flexibly adapting to various chip sizes and shapes, significantly reducing line changeover downtime, and markedly improving production line efficiency and mounting precision.

02 One-Time Mounting · Solving Two Major Challenges

In high-end device packaging such as optical modules and lidar, multiple chips often need to be integrated on the same substrate.

Due to material switching, traditional processes require frequent ejector needle changes, and multiple alignment steps can introduce cumulative errors, increasing mounting offset and process risks.

Zhuoxing's AS8136 high-precision multi-function mounter, with automatic ejector needle switching technology, supports continuous picking and mounting of multiple different chips in one go, without manual switching and correction during the process. This achieves high-precision mounting of multi-materials in a single pass, avoiding mid-process shutdowns and material changes, eliminating repeated positioning, significantly improving precision, reducing potential defects, and ensuring overall mounting yield.

Zhuoxing AS8136 High-Precision Multi-Function Mounter: Solving Multi-Product Production Challenges

Zhuoxing Semiconductor's AS8136 high-precision multi-function mounter integrates automatic ejector needle switching functionality, effectively solving multi-product co-line production challenges and enabling efficient and flexible production modes.

The equipment boasts the following advantages:

Full Material Compatibility:
Supports 2-inch to 12-inch wafers and various feeding methods including Waffle Pack and GelPAK;

High-Precision Mounting:
Applicable to diverse products such as optical modules, sensors, lidar, and MEMS motors;

Automatic Needle Change and Calibration:
No manual intervention required, reducing labor and equipment occupancy, minimizing downtime;

Intelligent Module Switching:
Automatically matches ejector needle modules according to chip size and shape, ensuring precise mounting.

Zhuoxing AS8136 High-Precision Multi-Function Mounter

Through automatic ejector needle switching technology, it rapidly adapts to mixed mounting of chips with different sizes and feeding methods, efficiently achieving chip mounting. After one-time debugging, no manual needle change or calibration is needed during production; it automatically replaces ejector needle modules, solving multi-material integration problems. It can automatically switch to the appropriate ejector needle module based on chip size and shape, ensuring precise mounting of chips onto substrates. This not only saves labor but also significantly reduces debugging downtime.

About Us

Founded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.

Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.

We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts.