In automotive Mini LED backlight manufacturing, two core challenges are being faced:

First, under the trend of "multi-category, small-batch" production, equipment compatibility and line changeover efficiency are insufficient;
Second, under automotive-grade "zero defect" quality requirements, traditional die bonding yield rates and process control are difficult to achieve.

Zhuoxing Semiconductor's newly launched AS3601 three-arm die bonder specifically addresses these two major pain points with technological innovation, fully meeting both efficiency and quality requirements of automotive backlight manufacturing.

Efficient Production Solution for "Multi-Category, Small-Batch"

01 - Full Size Coverage: Solving Equipment Resource Waste

Due to the variety of automotive screen sizes, a single piece of equipment cannot be compatible with all substrate sizes. Traditional die bonding equipment often requires different machine models to be used based on product dimensions, leading to equipment idleness.

Zhuoxing's AS3601 three-arm high-speed die bonder, however, can cover all substrate sizes of 270mm × 520mm and below with just one machine, perfectly适配 10 to 21-inch full series automotive backlight modules, meeting all mainstream automotive size requirements, significantly reducing equipment idleness, and solving the resource waste problem.

02 - Rapid Line Changeover: Solving Changeover Time Waste

When different products are produced on the same production line, different settings need to be switched. The "multi-product, small-batch" production mode of automotive backlighting means high frequency of line changeovers. Managing changeover efficiency is a major difficulty in improving overall production line efficiency.

Most die bonding equipment on the market uses串联 line configurations for equipment connection.串联 lines not only have long changeover times but can only achieve two modes: "single machine, single product" or "multiple machines, single product," resulting in low capacity efficiency and consuming significant time.

Zhuoxing Semiconductor adopts a parallel line production mode, with intelligent line configuration flexibility, significantly reducing changeover time.

It not only supports conventional "single machine, single product" or "multiple machines, single product" modes but also supports "multi-product co-line" production, meaning one line can simultaneously complete the production of multiple different products.

Product switching is more convenient, reducing time waste caused by line changes, greatly improving production line utilization and flexibility, easily handling "multi-category, small-batch" orders.

"Automotive-Grade" Quality Assurance

1. Real-Time Inspection + AI Warning, Yield Rate Up to 99.999%

01 - Visual Inspection Function

Zhuoxing's AS3601 three-arm die bonder integrates inspection into the mounting moment: pre-mounting position detection, on-the-fly flying vision correction during mounting.

Through real-time visual inspection, the entire mounting process is captured in real time, ensuring mounting position accuracy of ±15μm.

It also features post-mounting inspection functionality, immediately recording data when mounting deviations occur to ensure mounting precision and yield rate.

Achieving:
One Zhuoxing die bonder = One traditional die bonder + One post-bonding AOI

02 - AI Risk Warning

Combined with AI algorithms, it performs risk prediction and alerts. It immediately alarms when detecting conditions that could cause defects, preventing偏移 and defects at the source.

Example: Taking solder paste printing misalignment as an example. If the chip is placed directly, the misalignment will increase after reflow soldering. If AI risk warning is added, when solder paste is misaligned, the AI algorithm calculates the optimal position for chip placement, thereby reducing misalignment after reflow soldering.

2. Intelligent Production Management System, Traceable Quality

Under the "automotive-grade" zero-defect requirement, the yield rate requirements for chip mounting are increasingly high, and the ability to trace the mounting process of each module is necessary.

01 - Placement Mapping Management

Zhuoxing Semiconductor is equipped with Mapping functionality, recording the chip mounting path,实时统计 chip yield rate in real time, enabling intelligent production lines and traceable quality.

02 - Intelligent MES System

Performs quality management, binds data for each substrate,实时统计 yield rate and first-pass yield in real time, making the production line more intelligent.

About Us

Founded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.

Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.

We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts.