As electronic manufacturing evolves toward miniaturization and high performance, chip packaging processes face increasing challenges in precision, efficiency, and quality. Zhuoxing Semiconductor's AS7301 chip-level printer, with its industry-unique on-chip printing technology and core advantages of precise positioning and efficient printing, has become a key piece of equipment in high-end electronic manufacturing scenarios.

On-chip printing technology overcomes quality and efficiency issues in power device dispensing, achieving high-precision mass production.

Building on mature technological foundations, and to further meet industry production demands, the AS7301 chip-level printer has added three core new features, achieving a technological breakthrough and completing a comprehensive upgrade in production flexibility, stability, and intelligence. This provides robust support for enterprises to reduce costs and increase efficiency, contributing to the high-quality development of the electronic manufacturing industry.

These three core configurations—the compatible magazine and stack feeder assembly, automatic solder paste addition function, and optional AOI component—are innovative solutions developed by Zhuoxing Semiconductor specifically targeting pain points in power device packaging production. The configuration upgrades cover the entire production process of "feeding - solder paste addition - quality inspection," achieving dual optimization of production workflow and product quality through flexible adaptation, intelligent operation, and precise control. Their application scope covers mainstream power device packaging scenarios such as high-power diodes, MOS tubes, DrMOS, and multi-chip Clip.

Dual-Mode Flexible Feeding: Breaking Single Limitations, Adapting to Diverse Production

Traditional feeding equipment has single functions, only suitable for either stack or magazine feeding methods, making it difficult to accommodate both small-batch, multi-specification and large-volume, standardized production needs. This forces enterprises to purchase additional dedicated equipment, increasing costs and space occupancy. Moreover, production changeovers involve complex debugging, frequently affecting continuous production line operation.

The AS7301's new dual-mode flexible feeding system adopts a modular design, achieving "one machine, dual modes." By quickly replacing components, it can flexibly adapt to multi-specification production tasks without requiring additional equipment purchases, thereby reducing costs and increasing efficiency.

Stack Feeding: Suitable for high-volume continuous production, improving stack material handling efficiency.
Magazine Feeding: Adapts to standardized magazines, facilitating material management and changeovers.

Customers can switch freely based on order requirements, achieving seamless transition from R&D small batches to large-scale production, greatly enhancing production line responsiveness and equipment utilization.

Intelligent Automatic Solder Paste Addition: Precise Quantity Control, Eliminating Manual Reliance

The solder paste process is critical for determining soldering quality. Traditional manual addition methods have inherent limitations, including high variability in addition precision, susceptibility of solder paste to oxidation, and volatility of flux. The newly introduced automatic solder paste addition system on the AS7301 achieves precision and stability upgrades in the process through intelligent closed-loop control.

Precise Metering: Automatically executes based on parameters, ensuring consistency in the amount of solder paste added.
Dynamic Controllability: Continuously supplies small amounts of solder paste, reducing its exposure time to air.
Quality Assurance: Inhibits oxidation and moisture absorption, maintains flux activity, ensuring reliable soldering.
Cost Optimization: Precisely controls usage, reducing waste and saving costs.
Fully Automatic: Realizes unmanned solder paste addition, improving overall efficiency.

AOI Component: Real-Time Inspection, Data-Driven, Closed-Loop Quality Control

Traditional printing quality relies on manual spot checks, which suffer from low efficiency, susceptibility to missed inspections, and lack of systematic data support. Printing quality determines the success or failure of subsequent processes. The newly integrated AOI component in the AS7301 enables full-process control, enhancing quality assurance levels and reducing quality risks.

Precise Identification: Online real-time detection of glue dot area, position offset, and shape integrity.
Immediate Interception: Alarms immediately upon detecting anomalies, allowing rapid intervention to block defective products from flowing out.
Data Closed Loop: Automatically records defect information and generates reports, supporting integration with MES systems.
Process Optimization: Based on long-term data accumulation, reversely optimizes printing parameters, continuously improving first-pass yield.

The AS7301 chip-level printer, centered on the industry-exclusive on-chip printing technology, deeply integrates the advantages of high-precision narrow-edge printing for fitting, closed-loop pressure control for uniform glue dots, and stepless steel mesh adjustment for efficient production. By superimposing the three upgraded configurations of dual-mode flexible feeding, intelligent automatic solder paste addition, and AOI real-time inspection, it builds a comprehensive competitive advantage of "core technology + full-process optimization." With its ±0.01mm position accuracy, ±0.025mm angle accuracy, and capability to adapt to complex processes like 3D step printing, it comprehensively covers precision packaging scenarios for power devices such as high-power diodes, MOS tubes, and multi-chip Clip. It precisely meets the technical demands of miniaturization and high integration in high-end electronic manufacturing, as well as the complex packaging requirements for high-density interconnection of multiple chips. Simultaneously, its stable performance solidifies the quality foundation, simplifies production lines, lowers the operational threshold, providing an efficient and reliable integrated printing solution for productions of all scales.

About Us

Founded by an internationally leading team of motion control experts and bringing together the industry's top packaging technology specialists, we are a national high-tech enterprise and a specialized and sophisticated "Little Giant" enterprise with over 20 years of technological accumulation and market practice, focusing on the R&D, manufacturing, and sales of high-precision semiconductor equipment.

Our main products include semiconductor packaging equipment, power device packaging equipment, Mini LED chip transfer equipment, intelligent control equipment, and semiconductor packaging process management systems.

We are committed to providing customers with one-stop overall solutions for semiconductor packaging processes. Our products feature fully independent intellectual property rights, and many of our equipment models are industry firsts.