BackYour location:Home → Machines → Power Device Packaging
Features:
1. Adopt high-precision stencil printing, ensuring high consistency of the epoxy and patterns.
2. Epoxy application with short - edge squeegee, resulting in more stable pressure.
3. External loading and unloading devices are provided, facilitating single machine or multiple machines operations.
4. The special design for on - chip epoxy application, supporting printing on stepped and uneven surfaces.
5. Closed - loop pressure control is available, making the epoxy spots more uniform. (optional)
6. Provide AOI inspection function after epoxy application, which enables online monitoring of epoxy spots and evaluation of the stencil. (optional)
As smart cockpits evolve toward larger sizes and higher imag...
The article elaborates on the core mechanism of flip chip bo...
Break free from the limitations and failures of traditional ...
We have conducted an in-depth analysis of the core pain poin...
Hotline:0755-29691921
Phone:0755-29691921
Fax:0755-29691921
Email:market@asmade.cn
Address:Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province



official account


0755-29691921