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Driven by the continuous expansion of AI computing power, demand for highspeed optical modules is booming. According to forecasts cited by industry agency LightCounting, the global datacommunication Ethernet optical module market will reach USD 28.530.0 billion in 2026. 800G modules are entering largescale mass production, 1.6T products are accelerating commercial deployment, and 3.2T devices are in the sample validation phase. Alongside rate upgrades, SiP and Chiplet heterogeneous integration have become mainstream architectures for highspeed optical devices. Multilayer stacking eutectic packaging serves as the core process for highdensity integration. Against market growth, singlestage eutectic bonders reveal growing shortcomings in process implementation, production efficiency and yield control, creating practical massproduction challenges balancing precision, reliability and productionline flexibility.

The AS8138 HighPrecision Eutectic Bonder from Asmade adopts a dual eutecticstage architecture to balance stacking capability and largevolume manufacturing.

Featuring an innovative dual eutecticstage setup, the machine integrates two sets of eutectic processing workflows and natively supports two operating modes. Its architectural design eliminates defects caused by offline transfer during multilayer stacking, meeting requirements for both highvolume production and multilayer stacking processes. Furthermore, modular expansion options are available: a flip mechanism can be selected for flipchip eutectic manufacturing, and a fishbone fixture track enables efficient closedloop material handling across multiple stations, covering diverse differentiated packaging and manufacturing scenarios.

Mode 1: Dualstation Parallel Mass Production

The two eutectic stages execute eutectic bonding for the same product simultaneously. Parallel output from dual stations directly boosts overall machine throughput, targeting continuous highvolume manufacturing of standardized components.

Mode 2: InMachine ClosedLoop Secondary Stacking Eutectic

After the firstlayer chip eutectic bonding finishes on Eutectic Stage 1, semifinished products are transferred inside the equipment cavity to Eutectic Stage 2 for secondary stacking and soldering, without being taken out of the machine. All processes are completed within the equipment chamber, avoiding risks of collision, position offset and oxidation from offline exposure of semifinished goods. Alignment accuracy and soldering reliability for multilayer stacking are guaranteed.

Optional Flip Mechanism for FlipChip Process Production

An optional 180° chip flip mechanism enables chip attitude reorientation inside the machine without preflip operations outside the equipment. It adapts to flipchip eutectic scenarios and improves productivity and yield stability for flipchip processes.

Optional Fishbone Fixture Track for Efficient ClosedLoop MultiStation Scheduling

When configured with the fishbone fixture track and turrettype handling mechanism, six nozzles work collaboratively to build a closedloop station transfer workflow.

It efficiently performs chip picking, onstation vision alignment, and crossstation transfer of semifinished products. It supports parallel operation of dual eutectic stages and inmachine secondary stacking. Chip picking, inspection and eutectic bonding run concurrently to secure cycletime performance and placement consistency.

FullScope MassProduction Compatibility Advantages

The machine supports mainstream incoming material formats including wafers, waffle packs and GELPAK trays. Equipped with a turrettype handling mechanism, it enables mixedline production of multiple materials. A semiclosed negativepressure nitrogen chamber suppresses oxidation during soldering and widens the process window for AuSn eutectic bonding. It satisfies flexible production scheduling for optical modules with diverse models and mixed batch sizes.

Core Hardware Specifications

HighPrecision Placement Unit

X/Y placement positioning accuracy: ±3 μm; Angular accuracy: ±0.1°. Supported chip dimension range: 0.15 mm×0.15 mm to 10 mm×10 mm. Capable of processing various products such as MEMS and COC components.

Dual EutecticStage Temperature Control & Atmosphere System

Semiclosed eutectic modules with negativepressure nitrogen chamber environment. Eutectic stage heating rate: 100 °C/s; cooling rate: 50 °C/s; maximum operating temperature: 400 °C. Precise temperature control paired with inertatmosphere conditions optimizes AuSn soldering quality, inhibits oxidation, reduces void formation and ensures longterm device reliability.

MultiMaterial Wafer Stage Mechanism

Compatible with wafers, waffle packs and GELPAK trays. Six subring positions support flexible carrier switching via adapters. Up to four different ejector pins are selectable for synchronous processing of components of varying sizes.

TurretType HighSpeed Handling System

Six nozzles integrate chip picking, onstation vision alignment and product transfer functions. The fishbone fixture track manages station scheduling and realizes closedloop workflow of material picking, visual inspection and eutectic processing. An optional 180° chip flip mechanism reorients chips to maintain placement consistency under highspeed operation.

Intelligent Expansion & Connectivity

Bidirectional MES system access enables fullprocess traceability of process data. Expandable modules include automatic loading/unloading units and the 180° chip flip mechanism to adapt to diverse packaging processes and automatic productionline integration.

Conventional singlestage eutectic bonders cannot deliver high throughput, inmachine multilayer stacking and flexible multimaterial manufacturing simultaneously. Multimachine serial solutions bring high capital expenditure and elevated defect risks, hindering largescale production of nextgeneration highspeed optical communication devices. Featuring innovative dualeutecticstage architecture, the Asmade AS8138 HighPrecision Eutectic Bonder reduces yield loss caused by offline transfer in multilayer stacking at the hardware level. Optional flip mechanism and fishbone fixture track extend process capabilities. Supported by highspeed temperature control, negativepressure nitrogen atmosphere and multimaterial compatibility, it addresses weaknesses of legacy equipment in stacking processes, flexible manufacturing and soldering reliability. It delivers a domesticallydeveloped integrated highefficiency, highreliability eutectic solution for 800G/1.6T/3.2T highspeed optical modules and heterogeneousintegrated devices.

About Us

Shenzhen Asmade Semiconductor Technology Co., Ltd. is a nationallevel "Little Giant" enterprise specializing in advancedpackaging equipment and core semiconductor packaging technologies.

Founded by expert teams with worldclass motioncontrol and packaging expertise, the company boasts 20 years of accumulated technical knowhow and practical market experience. Its core businesses cover newdisplay packaging equipment, opticalcommunication device packaging equipment and PLP panellevel packaging equipment. It also builds a comprehensive product portfolio including powerdevice packaging equipment, intelligent control equipment and packagingprocess management systems.

Committed to delivering onestop, highperformance and highly reliable advancedpackaging solutions for global clients, it is a hightech enterprise integrating R&D, design, manufacturing, sales and technical services.