Cordially Invited | ASMADE Zhuoxing Semiconductor Meets You at CIOE 2026 — The 27th China International Optoelectronic Exposition

From September 9–11, 2026, ASMADE Zhuoxing Semiconductor will make a major debut at CIOE 2026 — The 27th China International Optoelectronic Exposition, showcasing a brand-new lineup of optical module packaging equipment: high-precision die bonders, high-precision eutectic bonding machines, high-precision couplers, and high-precision sorters.

Date: September 9–11, 2026

Venue: Shenzhen World Exhibition & Convention Center (Bao'an New Hall)

Booth No: Hall 10 — 10C11

Exhibited Products

AS8136 High Precision Semiconductor Die Bonder

Optical Communication Device Bonding | Planar Turret Mechanism | Accuracy ±3μm

Applications: Optical Modules, LiDAR, Sensors, SiP, Chiplet

AS8138 High Precision Eutectic Bonding Machine

Optical Communication Device Bonding | Dual Eutectic Stage Architecture | Accuracy ±5μm

Applications: Lasers, Microwave Components, Hermetic Packaging, Sensors, SiP

AS6001 High Precision Coupler

Accuracy ±0.5μm | Force Control Response ≤0.1s | Force Control ±2g

Applications: 100G–800G Single-Mode Optical Engines | Mass Production | Fully Automatic Optical Coupling Equipment

AS6002 High Precision Sorter

25 Megapixels | Accuracy 0.6245μm | Dual-Pin Anti-Magnetic Design

Applications: Optical Module Packaging | Chip Position / Angle Correction | Horizontal Leveling | High-Precision Sorting

Booth Information

We welcome experts and partners from all sectors to visit and exchange ideas. Let’s jointly research cuttingedge technologies and explore cooperation opportunities. We look forward to meeting you at the exhibition, joining forces to break new ground for the industry!

About Us

Shenzhen Asmade Semiconductor Technology Co., Ltd. is a nationallevel "Little Giant" specialized, sophisticated, unique and innovative enterprise focusing on advanced packaging equipment.  

Founded by a team of worldleading motion control and packaging experts, the company boasts 20 years of profound technical accumulation and market application experience. Its core business covers newgeneration display, opticalcommunication device mounting and PLP panellevel packaging equipment, alongside a complete product portfolio including powerdevice packaging equipment, intelligent control equipment and packaging process management systems.

Committed to delivering onestop, highperformance and highreliability advanced packaging solutions to global clients, the company is a hightech enterprise integrating R&D, design, manufacturing, sales and technical services.