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Features:
1. Dual CLIP bonding structure to enhance bonding efficiency;
2. Equipped with motion shot for monitoring CLIP status;
3. Visual recognition and correction of bonding positions to improve bonding accuracy;
4. Post-bonding inspection for real-time identification of defective products;
5. Serial connection for automatic left-in and right-out die loading and unloading;
6. Self-developed software operation and control platform for intelligent equipment operation
ASMADE, a leading provider of high-precision semiconductor e...
Zhuoxing Semiconductor has achieved a technological breakthr...
In the semiconductor packaging industry, the challenge of ba...
In semiconductor packaging processes, the challenge of multi...
Hotline：0755-29691921
Phone：0755-29691921
Fax：0755-29691921
Email：market@asmade.cn
Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
official account
0755-29691921
