On September 11, 2026, the threeday 27th China International Optoelectronic Exposition (CIOE) successfully concluded at Shenzhen World Exhibition & Convention Center (Bao’an New Hall). As a flagship event for China’s optocommunication and optoelectronic industries, this exhibition brought together numerous exhibitors and professional visitors from home and abroad, witnessing the innovation momentum and development vitality in the field of optocommunication packaging.

During the show, ASMADE Zhuoxing Semiconductor’s booth buzzed with communications. We exchanged technical achievements with industry peers and explored potential cooperation opportunities.

Booth Focus

At this exhibition, centering on optocommunication packaging application scenarios, Zhuoxing Semiconductor showcased a lineup of highprecision machines, including die bonders, eutectic bonders, optical aligners and material handlers. These devices cover core process nodes for optical module packaging. We can provide standalone equipment tailored to diverse customer process requirements, and deliver standardized, practical equipmentselection solutions for optocommunication component packaging.

Core Exhibits

AS8138 HighPrecision Eutectic Bonder

Featuring an innovative dualeutecticstation architecture, the AS8138 natively supports two sets of eutectic operation modes on one single machine. It avoids process defects caused by offline turnover in multilayer stacking, meeting both highvolume massproduction and multilayer stacking process demands. It achieves placement accuracy of ±3 μm and is compatible with eutectic processes for a wide range of optical components. At the exhibition, its distinctive structural design and massproduction adaptability drew heavy attention from customers. Multiple indepth technical discussions were held onsite regarding process adaptation and massproduction deployment.

Our full portfolio of optocommunication packaging equipment covers key processes including dieattach, eutectic bonding, optical alignment and material handling. Standalone units are available for different process flows, delivering solid equipment support for precise and largescale manufacturing of highspeed optical modules.

AS8136 HighPrecision MultiFunctional Die Bonder

Equipped with a planar turret placement mechanism, the AS8136 boosts efficiency by 60 % compared with swingarm models. It supports multiple processes such as dispensing, dipgluing, flipchip bonding and stacked packaging. AIenhanced accuracy compensation is enabled via downwardview cameras, with freely switchable ejector pins. It accepts multiple carrier formats including Waffle Pack and GelPAK. MES system connectivity enables full data traceability and flexible production, suiting highvolume manufacturing of optical modules, LiDAR and SiP devices.

AS6001 HighPrecision Optical Aligner

Built upon a 6axis fully closedloop precision motion platform, the AS6001 achieves alignment accuracy of ±0.5 μm. Its dualvision system integrates topview component identification & positioning plus bottomview accuracy compensation. Dispensing and UV curing are combined in one workflow to finish alignment and curing in a single pass. An airflotation antivibration design delivers excellent vibration suppression. It applies to fullyautomatic optical coupling for 100G800G singlemode optical engines and FA devices, poststage packaging of highspeed optical modules, and coupling of highprecision optical components.

AS6002 HighPrecision Material Handler

The AS6002 adopts two independentlycontrolled poking pins with ultraprecise force control of ±0.2 g to correct position and angle without scratching chip sidewalls. Visionguided alignment together with airflotation vibration isolation ensures stable operation. Its doubledeck magazine with four cassettes supports material loading & unloading. Designed for postdieattach correction in optical module packaging, it incorporates intelligent height detection and automatic cleaning. Capable of integrating with eutectic bonders and die bonders to form complete production lines, it helps raise packaging yield.

Exhibition Wrapup

The 27th China International Optoelectronic Exposition has built an efficient platform for exchange and collaboration across the optocommunication industry. Sincere gratitude goes to all industry partners for your visit and insightful conversations, which have brought fresh perspectives for our technological iteration and business cooperation.

Going forward, Zhuoxing Semiconductor will keep deepening its presence in advanced optocommunication packaging. We persist in independent technological innovation, continuously upgrading highprecision intelligent packaging equipment and process solutions. Targeting realworld massproduction pain points and technical challenges, we will leverage solid R&D capabilities and proven massproduction technologies to boost efficiency and advance the highend transformation of the optocommunication packaging industry, empowering highquality industrial development.

About Us

Shenzhen ASMADE Zhuoxing Semiconductor Co., Ltd. is a NationalLevel Specialized, Refined, Differential & Innovative “Little Giant” enterprise focusing on advancedpackaging equipment and core semiconductor packaging technologies.

Founded by worldclass experts in motion control and packaging technology, our team boasts 20 years of profound technical accumulation and practical market experience. Our core businesses cover newdisplay packaging equipment, optocommunication component packaging equipment and PLP panellevel packaging equipment. We also maintain a comprehensive product portfolio spanning powerdevice packaging, intelligent control equipment and packagingprocess management systems.

Committed to delivering onestop, highperformance and highlyreliable advancedpackaging solutions for global clients, we are a hightech enterprise integrating R&D, design, manufacturing, sales and technical services。