Automatic Clip Bonding Solution AS2001
2024-10-14(3138)Browse
Features:
1. Adopt stencil printing to improve printing efficiency and precision
2. Use a turret bonder with adjustable bonding angles and pressures
3. Optional secondary printing on silicon wafers to achieve stacked packaging
4. Equipped with CLIP bonding with motion shot for position correction and post-bonding inspection
5. Utilize a Formic Acid Vacuum Reflow Oven to enhance welding yield and improve machine stability
6. Self-developed software operation and control platform for intelligent equipment operation
New Information
-
You Are Cordially Invited | ASMADE Joins You at SEMICON China 2026 & electronica China
ASMADE, a leading provider of high-precision semiconductor e...
-
Technological Breakthrough! Chip-Level Printer Adds Three New Features
Zhuoxing Semiconductor has achieved a technological breakthr...
-
Multi-Process vs. Precision vs. Speed: How to Simultaneously Balance the Equipment
In the semiconductor packaging industry, the challenge of ba...
-
Automatic Ejector Needle Switching Technology | Solving Multi-Material Mixed Mounting Challenges
In semiconductor packaging processes, the challenge of multi...
0755-29691921
Hotline：0755-29691921
Phone：0755-29691921
Fax：0755-29691921
Email：market@asmade.cn
Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
0755-29691921