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Automatic Clip Bonding Solution AS2001

2024-10-14(3420)Browse

Features:1. Adopt stencil printing to improve printing efficiency and precision2. Use a turret bonder with adjustable bonding angles and pressures3. Optional secondary printing on silicon wafers to ac...

Features:

1. Adopt stencil printing to improve printing efficiency and precision

2. Use a turret bonder with adjustable bonding angles and pressures

3. Optional secondary printing on silicon wafers to achieve stacked packaging

4. Equipped with CLIP bonding with motion shot for position correction and post-bonding inspection

5. Utilize a Formic Acid Vacuum Reflow Oven to enhance welding yield and improve machine stability

6. Self-developed software operation and control platform for intelligent equipment operation

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0755-29691921

Hotline：0755-29691921

Phone：0755-29691921

Fax：0755-29691921

Email：market@asmade.cn

Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province