Direct Display Solution
2023-05-12(2040)Browse
The overall solution of MiniLED packaging process is formed through online printing machine, crystal fixing machine, reflow soldering soldering, lighting detector and wafer repair machine, providing printing, bonding, packaging, repair and other services for Mini Led display
New Information
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Chip-Level Printer | Printing power device frames in the X axis direction, combined with on-chip printing technology
The world's first semiconductor chip-level printer with ...
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Semiconductor Epoxy Die Bonder | Combining Spot Epoxy Process with Die Bonding Process in One Machine, Capable of Handling Numerous Products.
The Epoxy Die Bonder is a semiconductor machine that feature...
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ASMADE cordially invites you to SEMICON CHINA 2025.
ASMADE cordially invites you to SEMICON CHINA 2025.From Marc...
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Competitiveness Analysis of MiniLED Backlight Packaging Enterprises in Chinese Mainland
In the past decade, the LED industry has focused on lighting...
0755-29691921
Hotline：0755-29691921
Phone：0755-29691921
Fax：0755-29691921
Email：market@asmade.cn
Address：Building 3, Xifengcheng Industrial Park, Fuhai Street, Bao'an District, Shenzhen City, Guangdong Province
0755-29691921