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Asmade Semiconductor Double Arm Single Board Solidification, Improving the Growth and Quality of the Display Panel Industry

2023-05-10(1307)Browse

With the development of technology and the improvement of living standards, people have higher requirements for displays, and ultra high definition 4K and 8K large-sized display applications have become a more favored choice for people.
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With the development of technology and the improvement of living standards, people have higher requirements for displays, and ultra high definition 4K and 8K large-sized display applications have become a more favored choice for people. Therefore, the development of LED towards micro spacing display has become an inevitable trend, and Mini LED has gradually become the industry's trend. Mr. Zeng Yiqiang, founder of Zhuoxing Semiconductor, shared, "Mini LED is a transitional product of the evolution from LED to Micro LED, and an evolution and upgrade of traditional LED. This evolution and upgrade is not only reflected in display performance, but also in packaging process technology

Due to the "ceiling" effect faced by the original SMD packaging process, when the product spacing drops below P1.0 (micro spacing), the number of lamp beads per unit begins to double, and traditional mounting processes are no longer able to meet current needs. The corresponding packaging process, flip chip COB, has begun to emerge with its performance advantages. According to the founder of Zhuoxing Semiconductor, COB (Chip On Board) directly encapsulates LED chips on a PCB circuit board. Compared to traditional process routes, it encapsulates LED chips and brackets into lamp beads, and then attaches the lamp beads to the PCB. This not only saves packaging steps, but also greatly improves reliability and product quality.


The impact of the development of inverted COB technology on the industry market structure has become a focus of attention for many brands in the industry, with Zhuoxing Semiconductor being one of them. Zhuoxing Semiconductor, positioned as a service provider for the overall solution of the Mini LED packaging process, focuses on the layout of flip chip COB and has independently developed ASM series solidification machines, repair machines, as well as ASP series transfer modules, turret modules and other equipment, specifically solving the technical and process challenges faced by the solidification, detection, bonding, repair and other processes of Mini LED.


Regardless of the technical solution, efficiency is one of the key factors that needs to be considered for Mini LED crystal fixation. Both backlighting and direct display require a large number of LED chips, and solder paste has timeliness, and once the solder paste denatures, it cannot be fixed properly. So the more solid crystals per unit time, the more advantageous it is for Mini LEDs.


Based on the consideration of crystal solidification efficiency and the current problems of crystal solidification machines in the market, Zhuoxing Semiconductor has creatively developed two sets of double arm single plate crystal solidification modes, namely double arm single plate alternating crystal solidification and double arm single plate synchronous crystal solidification. Taking a well-known brand's dual arm and dual board crystal solidification machine on the market as an example, this crystal solidification machine is operated synchronously with two swing arms corresponding to two substrates. There is still one swing arm on one substrate, and the crystal solidification efficiency per unit substrate has not increased, which is equivalent to copying a set of equipment. And Zhuoxing Semiconductor's dual arm single board alternating crystal solidification method involves two swing arms corresponding to one substrate, and two swing arms alternating crystal solidification on one substrate, resulting in a significantly higher unit output value than the dual arm dual board crystal solidification machine.


In addition, Zhuoxing Semiconductor's dual arm single board synchronous crystal solidification also has two swing arms corresponding to one substrate. However, this set of crystal solidification mode involves two swing arms simultaneously zoning crystal solidification on one substrate, and the substrate completes two crystal solidification in one positioning, which is more efficient than the dual arm single board alternating crystal solidification. Therefore, in terms of efficiency alone, the advantages of Zhuoxing Semiconductor Solidification Machine are very obvious.

The limitation of the timeliness of solder paste objectively exists, so the more solid crystals a solidification machine has per unit time, the larger the substrate can be made. This makes it possible for Mini LED to be of large size, and the clarity will naturally increase. People's demand for ultra high definition 4K, 8K, and even larger display applications will also be more easily met.


The products corresponding to these two solidification modes are ASM3603 double swing arm alternating solidification machine and ASM3602 double swing arm synchronous solidification machine launched by Zhuoxing Semiconductor. The actual fitting error is less than 0.015mm, and the straight-through yield is greater than 99.99%. High precision, fast speed, high yield, and large solidification range are widely recognized evaluations of these two solidification machines in the industry.


Packaging process service provider, Zhuoxing technology leader! Zhuoxing Semiconductor has its own answer to the issues of yield, micro spacing, and process efficiency faced by the Mini LED process, with the dual arm single board fixed crystal mode being one of them. Continuously surpassing and striving for excellence, Zhuoxing Semiconductor is dedicated to researching semiconductor technology with a spirit of focus, craftsmanship, and pragmatism, contributing its own strength to the national semiconductor industry, and hoping to enable consumers around the world to enjoy the happy life transmitted by Zhuoxing.


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