Features:

1.  Ultra-large substrate size, reduces the number of seams.

2.  Multi-station die bonding with chip light-emitting layer damage detection.

3.  Real-time bond head angle correction and pressure control.

4.  Adopting marble machine workplace for higher stability.

5.  Adopt linear motor module for higher durability.

6.  Vacuum inspection to bonding omissions and anti-clogging nozzle design.

7.  Vacuum die bonding platform and surface flatness correction design.

8.  Automatic correction using parallel connection.

9.  Optional automatic die ring switch component to improve die bonding efficiency.

10.  Self-developed software operation and control platform for intelligent equipment operation.